3D IC Stacking Technology

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3D IC Stacking Technology

3D IC Stacking Technology

Name: 3D IC Stacking Technology
ISBN: 9780071741958

Banqiu Wu, Ajay Kumar, Sesh Ramaswami

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The latest advances in three-dimensional integrated circuit stacking technology

With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.

3D IC Stacking Technology covers:

High density through silicon stacking (TSS) technology

Practical design ecosystem for heterogeneous 3D IC products

Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack

Process integration for TSV manufacturing

High-aspect-ratio silicon etch for TSV

Dielectric deposition for TSV

Barrier and seed deposition

Copper...

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