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Encyclopedia of Thermal Packaging (Set 1) Thermal Packaging...

Encyclopedia of Thermal Packaging (Set 1) Thermal Packaging Techniques, Volumes 1-6

Bar-Cohen, Avram
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Thermal and mechanical packaging -- the enabling technologies for the physical implementation of electronic systems -- are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.
Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. This book will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.
年:
2013
出版商:
World Scientific
語言:
english
頁數:
1438
ISBN 10:
9814313807
ISBN 13:
9789814313803
文件:
PDF, 31.33 MB
IPFS:
CID , CID Blake2b
english, 2013
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